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Tech Briefs/Application Notes
- Tech Brief: Eutectic Die-Attach of GaN and GaAs MMICs
- Tech Brief: Tips for Increasing Yields when Wire Bonding Small MESA Chips
- Tech Brief: How RF and Microwave Companies Can be Empowered by US-based Contract Manufacturing
- Tech Brief: Leveraging the Precision of Ion Beam Milling Vs. Chemical Etching of Thin Film Circuits
- Outline Drawings
- Planar Chip Inductors Datasheet
- Attenuator Datasheet
- OL 10120 Outline
- An Introduction to Ion Beam Etching
- OL-20478 Outline
- OL-20479 Outline
- PK14-2 Outline
Our technical team is here to support you at every step in the design, development, manufacturing, and testing of your components and assemblies. Review our FAQs for common questions and answers and submit your additional questions today.
FAQs
SemiGen is capable of producing thin film circuits with lines and space widths as low as .0005". To learn more download our thin film design guidelines >>
Small mesa chip bonding is an art that requires process know-how and specialized tools. We've covered this issue in depth in our tech brief "Tips for Increasing Yields When Wire Bonding Small Mesa Chips" >>
While both are technically considered subtractive processes, our anisotropic ion beam milling, or etching process, is a more precise, repeatable, and cleaner approach over the more random process of traditional material subtraction via chemical etching. Learn more by reading our tech brief "Leveraging the Precision of Ion Beam Milling Vs. Chemical Etching of Thin Film Circuits" >>
