SemiGen is vastly experienced in the manufacturing of RF, microwave, and millimeter-wave circuits and assemblies, with particular expertise in mixed RF/digital assembly—including microcontrollers. Our dedicated team of highly trained and certified assemblers are experts in eutectic attachment, advanced thermo compression, ultrasonic wire or ribbon, ball bonding, and hand-assembly techniques. For precision assembly, our automatic bonding and die attach equipment is trusted by leading brands when component position, loop height, and spacing are critical to performance.
In addition to RF/microwave assembly, SemiGen is also experienced in producing industrial transducers, encoders, and control boards; medical sensors and instrumentation boards; and optoelectronic LED assemblies, receivers, and drivers.
As MESA chips have decreased in size, so too have their bonding areas. Download our latest Tech Brief and learn how to overcome the challenges of wire bonding to even the smallest MESA chips.
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