RF/Microwave Assembly of Hybrid Multi-function Assemblies, Discrete Modules and Components

SemiGen is vastly experienced in the manufacturing of RF, microwave, and millimeter-wave circuits and assemblies, with particular expertise in mixed RF/digital assembly—including microcontrollers. Our dedicated team of highly trained and certified assemblers are experts in eutectic die attachment, advanced thermo compression, ultrasonic wire or ribbon bonding, ball bonding, and manual assembly techniques. For precision assembly, our automatic bonding and die attach equipment is trusted by leading brands when component position, loop height, and spacing are critical to performance.

In addition to RF/microwave assembly, SemiGen is also experienced in producing industrial transducers, encoders, and control boards; medical sensors and instrumentation boards; and optoelectronic LED assemblies, receivers, and drivers.

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Standard Services:

  • Eutectic Die Attach 
  • Epoxy Attach
  • Wire Bonding (gold and aluminum wire)
  • Ribbon Bonding
  • Coil Winding and Tacking
  • Beamlead Diode Attachment
  • RF Feedthru Installation
  • Board Installation (epoxy, solder, screw-down)
  • Hand Soldering
  • Surface Mounting
  • Epoxy Encapsulation

We Assemble:

  • Amplifiers
  • Attenuators
  • Detectors
  • Diodes
  • Drivers (chip/wire)
  • Duplexers
  • FETs
  • Filters
  • GaAs and GaN Devices
  • Mixers
  • Multi-function Assemblies
  • Optical components
  • Oscillators
  • Power supplies
  • Receivers
  • Sensors
  • Switches
  • Thin Film Circuits
  • Transistors
  • Transmitters
  • Up/downconverters

SemiGen: Tips for Increasing Yields when Wire Bonding Small MESA Chips

Tech Brief Describes How To Bond Small Mesa Chips

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