SemiGen is vastly experienced in the manufacturing of RF, microwave, and millimeter-wave circuits and assemblies, with particular expertise in mixed RF/digital assembly—including microcontrollers. Our dedicated team of highly trained and certified assemblers are experts in eutectic attachment, advanced thermo compression, ultrasonic wire or ribbon, ball bonding, and hand-assembly techniques. For precision assembly, our automatic bonding and die attach equipment is trusted by leading brands when component position, loop height, and spacing are critical to performance.
In addition to RF/microwave assembly, SemiGen is also experienced in producing industrial transducers, encoders, and control boards; medical sensors and instrumentation boards; and optoelectronic LED assemblies, receivers, and drivers.
The common failure modes of wire bonds, for instance cratering/peeling, bond wire damage, trailing wire bond tails, poor adhesion, and missed bond pads, are exacerbated when wire bonding small MESA chips. There are many variables that need to be balanced to optimize a wire bond process, and limit the amount of time consuming and costly rework and part failures. With decades of experience successfully wire bonding small MESA chips for military, aerospace, satellite communications, and other applications, SemiGen experts share some of their insights into the challenges of wire bonding these ever-shrinking ICs.
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