Resistors

SemiGen builds high power tantalum nitride resistor chips to customer specifications. We can manufacture chip resistors using a variety of substrates in various thicknesses to meet your specific needs. Resistors can be produced with element features under 0.002 inch for high density or high value resistor applications. Low noise stable TCR and chip sizes under 0.010 inch x 0.020 inch are routinely processed in production quantities. SemiGen’s series of Thin Film Resistors offer proven stability, low noise, and excellent TCR of both Tantalum Nitride (TaN) and Nichrome (NiC) resistive films. From our standard product offering, to custom requirements, this series of resistors is offered in a large selection of chip size, resistance values, and tolerances.

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Part Number Ordering Key

  Resistor Series
SIR Single Value, Pad to Pad Chip Resistor (Top to Top)
STR Single Value Thru Chip Resistor (Top to Bottom)
SMR Multiple Tap Resistor Chip
SCR Dual Value, Center Tap Resistor Chip

 

  Substrate Material
N Aluminum Nitride
B Beryllium Oxide
S Silicon
Q Quartz
C Ceramic (99.6% Alumina)

 

  Outline Die Size
R1 Multiple Tap (20) 0.038"X0.038"
R2 Dual Tap 0.030"X0.030"
R3 Single Value 0.020"X0.020"
R4 Single Value Ladder (6) 0.020"X0.060"
R5 Multiple Tap (12) 0.030"X0.030"

 

Basic equation for calculating resistance

The resistance of a specific resistor depends on its aspect ratio (the ratio of its length to width) expressed as a number of “squares”. (Note: the term “square” is dimensionless).

 

R = s(L/W) where:

R = resistance in ohms

s = sheet resistance in ohms/sq

L = Length of the resistor

W = width of the resistor Resistor “length” is always the dimension of the resistor parallel to the current flow.

Features:

  • Single value or network applications available in chip sizes under 0.020" x 0.020"
  • Sheet resistivity from 25 to 200 ohms per square
  • Long term stability is less than 0.5% change in value over 1000 hours at 125°C in air

Applications:

Tantalum nitride is self-passivating (moisture resistant). The tantalum pentoxide passivation is formed during our air anneal stabilization process. For high power chip resistors, substrates of aluminum nitride and beryllium oxide are commonly used.

 

Resistors

 

 

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