Thin Film Circuits

SemiGen offers build-to-print services for a wide range of materials and metallization schemes. We use or processing technology to fabricate circuits on As-Fired Alumina, Polished Alumina, Superstrate TPS, Aluminum Nitride, Beryllium Oxide, Fused Silica/Quartz, Sapphire, and Hi-K Dielectrics.

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Our process fab utilizes multiple equipment sets to be able to deploy a wide variety of techniques to meet todays demanding designs. Processes include Filled Vias, Plated Thru Holes, Ion Beam Milling, Sputtering, Photolithography, Electroplating and Dicing. Utilization of our ion beam etch process provides precision line definition and known proven improved performance over high frequency ranges in comparison to traditional checmical etching.

 

SemiGen’s expertise comes from the acquisition of Ion Beam Milling in 2018 and the integration of that technology into our process fab.

 

Our metallization capability allows us to deposit:

- Aluminum

- Chrome

- Nickel

- Gold

- Palladium

- Platinum

- Titanium

- Tungsten

- Tantalum Nitride

We process with the following substrate materials:

  • Alumina- As-Fired and Polished, 99.5% or greater
  • Aluminum Nitride
  • Quartz/Fuzed Silica
  • Sapphire
  • Ferrite/Garnet
  • Titanates (Hi-K materials)
  • Glass
Tech Brief Helps Make Critical Thin Film Manufacturing Decision
Resource

Tech Brief Helps Make Critical Thin Film Manufacturing Decision

Thin Film Circuit Design Guidelines Provide Keys to Successful Layout of Ion Beam Etched Circuits
Resource

Thin Film Circuit Design Guidelines Provide Keys to Successful Layout of Ion Beam Etched Circuits

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