SemiGen offers build-to-print services for a wide range of materials and metallization schemes. We use our processing technology to fabricate circuits on As-Fired Alumina, Polished Alumina, Superstrate TPS, Aluminum Nitride, Beryllium Oxide, Fused Silica/Quartz, Sapphire, and Hi-K Dielectrics.

SemiGen specializes in the manufacture of custom thin film circuits and other thin film products. Circuits can be manufactured to your drawing specifications, or we can work with your engineers to design a thin film circuit that meets your requirements.
Our fabrication facility uses a variety of equipment and manufacturing techniques to meet today's demanding design requirements. Processes include filled vias, plated through-holes, ion beam milling, sputtering, photolithography, electroplating, and dicing. Our ion beam etching process provides precise line definition and improved high-frequency performance compared with traditional chemical etching.
SemiGen’s expertise includes technology acquired through the acquisition of Ion Beam Milling in 2018 and its integration into our fabrication processes.
| Substrate Types | Resistor Films and Metallization | ||
|---|---|---|---|
| Alumina | Al2O3 | Tantalum Nitride (TaN) Resistor Film | 20–200 Ω/sq |
| Aluminum Nitride | AlN | Titanium Tungsten Gold | TiW/Au |
| Fused Silica | SiO2 | Titanium Tungsten Nickel Gold | TiW/Ni/Au |
| Beryllium Oxide | BeO | Titanium Platinum Gold | Ti/Pt/Au |
| Diamond | C | Chromium Copper Gold | Cr/Cu/Au |
Our metallization capabilities include depositing the following materials:
Whether your requirement is for low-volume or production-volume manufacturing, SemiGen is ready to deliver. Our ion beam etching process produces accurate and repeatable thin film circuit features, along with other thin film products that meet our customers' quality requirements.
We process with the following substrate materials: