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The common failure modes of wire bonds, for instance cratering/peeling, bond wire damage, trailing wire bond tails, poor adhesion, and missed bond pads, are exacerbated when wire bonding small MESA chips. There are many variables that need to be balanced to optimize a wire bond process, and limit the amount of time consuming and costly rework and part failures. With decades of experience successfully wire bonding small MESA chips for military, aerospace, satellite communications, and other applications, SemiGen experts share some of their insights into the challenges of wire bonding these ever-shrinking ICs.
Five Common Wire-Bond Failure Modes 1. Cratering and Peeling Due to the high pressures and heat involved with thermocompression, which also impacts thermosonic wire bonding to some degree, cratering and peeling of the wire bond pad is possible.Read More
If you've been looking for replacement devices or a new first or second source for your RF and microwave diodes and semiconductors, you can rely on SemiGen. Industry veteran and founder of SemiGen, Jim Morgan, has committed to an RFRead More
Small MESA devices have posed a number of wire-bonding challenges, which have required advancements in wire-bonding technologies and skills. As MESA chip size has shrunk and market forces necessitate faster processes with higher yields, the difficulty around wire bonding MESARead More
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