SemiGen


RF/Microwave Services and Products on Demand

SemiGen is growing. We're reinvesting every day to ensure that with every new microwave challenge you're presented, we'll be here to resolve it for you. From microwave design, to microwave hybrid and PCB assembly and testing, to components, supplies, and even custom semiconductors, SemiGen gives you the edge to compete at another level.

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Where Can You Find and Buy RF and Microwave Diode Replacements?

Where Can You Find and Buy RF and Microwave Diode Replacements?

If you've been looking for replacement devices or a new first or second source for your RF and microwave diodes and semiconductors, you can rely on SemiGen. Industry veteran and founder of SemiGen, Jim Morgan, has committed to an RF

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From New Wire Bonding Techniques and Types of Wire Bonding, to the Challenges of Working with Small MESA Chips- What You Need to Know About the Process

From New Wire Bonding Techniques and Types of Wire Bonding, to the Challenges of Working with Small MESA Chips- What You Need to Know About the Process

Small MESA devices have posed a number of wire-bonding challenges, which have required advancements in wire-bonding technologies and skills. As MESA chip size has shrunk and market forces necessitate faster processes with higher yields, the difficulty around wire bonding MESA

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Tech Brief Describes the Best Eutectic Die-attach Method for MMICs in Hybrid Assemblies

Tech Brief Describes the Best Eutectic Die-attach Method for MMICs in Hybrid Assemblies

The Tech Brief reviews the many challenges (often related to metal-quality and thickness) needing to be overcome when developing a repeatable eutectic die-attach process, including avoiding contamination, ensuring the quality of the pickup collets, and balancing efficiency and accuracy during screening procedures.

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SemiGen: Tips for Increasing Yields when Wire Bonding Small MESA Chips

Tech Brief Describes How To Bond Small Mesa Chips

The common failure modes of wire bonds, for instance cratering/peeling, bond wire damage, trailing wire bond tails, poor adhesion, and missed bond pads, are exacerbated when wire bonding small MESA chips. There are many variables that need to be balanced to optimize a wire bond process, and limit the amount of time consuming and costly rework and part failures. 

 

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