SemiGen is growing. We're reinvesting every day to ensure that with every new microwave challenge you're presented, we'll be here to resolve it for you. From microwave design, to microwave hybrid and PCB assembly and testing, to components, supplies, and even custom semiconductors, SemiGen gives you the edge to compete at another level.
If you've been looking for replacement devices or a new first or second source for your RF and microwave diodes and semiconductors, you can rely on SemiGen. Industry veteran and founder of SemiGen, Jim Morgan, has committed to an RFREAD MORE
Small MESA devices have posed a number of wire-bonding challenges, which have required advancements in wire-bonding technologies and skills. As MESA chip size has shrunk and market forces necessitate faster processes with higher yields, the difficulty around wire bonding MESARead More
The Tech Brief reviews the many challenges (often related to metal-quality and thickness) needing to be overcome when developing a repeatable eutectic die-attach process, including avoiding contamination, ensuring the quality of the pickup collets, and balancing efficiency and accuracy during screening procedures.Read More
The common failure modes of wire bonds, for instance cratering/peeling, bond wire damage, trailing wire bond tails, poor adhesion, and missed bond pads, are exacerbated when wire bonding small MESA chips. There are many variables that need to be balanced to optimize a wire bond process, and limit the amount of time consuming and costly rework and part failures.
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