Wafer Dicing on Silicon, Glass and Ceramic materials

Wafer Dicing Services

SemiGen provides dicing services on Silicon, Glass and Ceramic materials. SemiGen utilizes Disco a world leader in dicing saw equipment. Disco saws employ a thin, diamond blade mounted on a high-speed air bearing spindle and are equipped with microscopes and video feeds to ensure precision alignment. Equipment such as the Disco DAD3220 saw affords fully programmable operation and can be used in higher production volume demands. SemiGen’s process can return the diced material to you on UV Tape, Blue Tape, Vial or fully cleaned, loaded and inspected in Waffle or Gel Paks. SemiGen processes both our own as well as our customer’s materials up to 6” (150 mm) in diameter. In addition to standard materials, SemiGen can develop custom dicing and cutting procedures for almost any material required by our customers.


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Materials to be Diced:

  • Silicon
  • GaAs
  • Alumina
  • Alumina Nitride
  • BEO
  • Glass
  • Quartz
  • Safire
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