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We have released our thin film circuit design guidelines. Designed to help RF, microwave, and millimeter-wave circuit design engineers with optimizing their layouts for our advanced ion beam milling (or etching) process, the layout tolerances and approaches include the following key areas of design for creating optimal Lange couplers, stand-offs, filters, terminations, planar and spiral inductors, [...] Read More
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We have released a new Tech Brief "Leveraging the Precision of Ion Beam Milling Vs. Chemical Etching of Thin Film Circuits" that details the advantages to RF/microwave circuit designers of manufacturing their circuits using ion beam milling over chemical etching. This tech brief describes manufacturing thin film circuits using a next-generation anisotropic ion beam milling process [...] Read More
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We have announced the publication of a new Tech Brief “Eutectic Die-Attach of GaN and GaAs MMICs.”  The latest in RF/microwave GaN and GaAs MMIC circuit chips (die) are providing higher power levels than previous solid-state technologies. These new-generation devices require incredible precision and consistency throughout the die-attach and microwave assembly process to ensure that [...] Read More
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SemiGen, Inc. announces a new Technical Brief, “Tips for Increasing Yields when Wire Bonding Small MESA Chips,” discussing the challenges of wire bonding to small MESA chips. This latest brief provides insights into the wire bonding process and shares tips on how to analyze and overcome the pitfalls when wire bonding small MESA chips. Progressively, MESA chips have decreased in size. [...] Read More
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The increased cost and complexity of designing, prototyping, assembling, troubleshooting, and redesigning modern RF/microwave assemblies that meet stringent government, military, and aerospace requirements is leading to a substantial growth in US-based contract manufacturing. In order to support OEMs and Primes, which can benefit from the diverse testing, assembly, and design capabilities of quality [...] Read More
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