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We have announced the publication of a new Tech Brief “Eutectic Die-Attach of GaN and GaAs MMICs.”  The latest in RF/microwave GaN and GaAs MMIC circuit chips (die) are providing higher power levels than previous solid-state technologies. These new-generation devices require incredible precision and consistency throughout the die-attach and microwave assembly process to ensure that [...] Read More
SemiGen, Inc. announces a new Technical Brief, “Tips for Increasing Yields when Wire Bonding Small MESA Chips,” discussing the challenges of wire bonding to small MESA chips. This latest brief provides insights into the wire bonding process and shares tips on how to analyze and overcome the pitfalls when wire bonding small MESA chips. Progressively, MESA chips have decreased in size. [...] Read More
The increased cost and complexity of designing, prototyping, assembling, troubleshooting, and redesigning modern RF/microwave assemblies that meet stringent government, military, and aerospace requirements is leading to a substantial growth in US-based contract manufacturing. In order to support OEMs and Primes, which can benefit from the diverse testing, assembly, and design capabilities of quality [...] Read More
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