SemiGen


Tech Brief Describes the Best Eutectic Die-attach Method for MMICs in Hybrid Assemblies

Posted on Tuesday, August 14, 2018

We have announced the publication of a new Tech Brief “Eutectic Die-Attach of GaN and GaAs MMICs.” 

The latest in RF/microwave GaN and GaAs MMIC circuit chips (die) are providing higher power levels than previous solid-state technologies. These new-generation devices require incredible precision and consistency throughout the die-attach and microwave assembly process to ensure that the thermal flux from these devices is efficiently conducted to the heat spreaders and away from the transistor-gate regions. 

The Tech Brief reviews the many challenges (often related to metal-quality and thickness) needing to be overcome when developing a repeatable eutectic die-attach process, including avoiding contamination, ensuring the quality of the pickup collets, and balancing efficiency and accuracy during screening procedures. The brief also details the key factors in determining if a eutectic die-attach process is sophisticated enough to serve the mission-critical applications of today’s aerospace, military, Satcom, and telecommunications applications. 

We are a trusted manufacturing partner that has aided many customers in developing these precision eutectic die-attach processes. The result is repeatable ultra-reliable die-attach for their devices that are routinely deployed in critical, hi-rel land, sea, air, and space missions around the globe.

To learn more, download the full tech brief today.

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