We're Excited to Feature our Expanded Thin Film Capabilities at EDI CON 2018 After Acquisition of Ion Beam Milling
Last week, we announced that after recently acquiring Ion Beam Milling of Manchester, NH, we are now offering a full suite of thin film circuit and foundry services to augment our microwave assembly and component solutions offered to RF/microwave manufacturers.
We’ll be discussing these and other contract services at the 2018 Electronic Design and Innovation Conference (EDI-CON) on October 17 – 18th in booth #206 at the Santa Clara Convention Center.
Custom and standard components added to our offerings now include thin film circuits, attenuators, lange couplers, filters, diode submounts, planar inductors, standoffs, and transmission lines. Additional foundry services also recently added include wafer dicing and metallization.
Each year, we’re looking to increase our capability to be a dedicated, full service microwave manufacturing partner,” said Tim Filteau, President of SemiGen. “Thin film is a core requirement of many advanced EW and radar subsystems, so we’re proud to be adding it to our suite of in-house solutions.”
Stop by booth #206 at EDI CON to chat with our team about this new acquisition and learn about our new thin film capabilities and services.
Learn more about EDI CON and register today!
