SemiGen provides high-quality, automated PCB assembly for high-mix, low- to medium-volume printed circuit boards. SemiGen helps manufacturers of military electronics, commercial products, and medical instrumentation with their leadless, fine-pitch, BGA, and QFP assembly requirements. They do this with a team of certified J-STD-001 and IPC 610 assem-blers, two fully automated, surface-mount MYDATA machines, and high-temperature multizoned reflow ovens. They are proficient in VGA placement and also offer additional through-hole manufacturing capabilities.
The automated PCB line can handle and place a full range of components on virtually any board. This includes everything from 00105 and CSP/FC components to complicated BGA and QFP types. With the trend towards miniaturization and odd-shaped components, it's critical for manufacturers of military electronics, commercial products, and medical instrumentation to have access to such an all-in-one machine and the experienced staff who run it.
SMT assembly capabilities include: high-mix automated PCBA, manual through-hole, leadless, fine pitch, VGA/BGA, micro BGA, QFP, LIDS, diverse passive components, large boards up to 44" x 32" and 1/2" thick, odd-shaped boards, Intelligent Surface Impact Control (ISIC), lead-free, design services, and quick-turn prototypes.