High-Frequency Testing and Screening

As a true full-service supplier, SemiGen is dedicated to providing turnkey electrical and quality testing of your RF/microwave hybrids and components up through 50 GHz in our in-house test lab. We also provide final inspection and test reports with Certificate of Compliance, as well as full tuning to your requirements. Typical tuning methods include stub-tuning, impedance matching, capacitive, and inductive.

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Test Parameters:

  • Isolation
  • Insertion loss
  • Gain
  • Noise figure
  • VSWR
  • Phase and phase tracking
  • IP3
  • Switching speed
  • Various power testing
  • Lifetime
  • Series resistance
  • DC electricals VF, VB, CT, IR
  • Bond-pull testing and die-shear
  • Failure analysis of diodes and passives

SemiGen: Tips for Increasing Yields when Wire Bonding Small MESA Chips

Tech Brief Describes How To Bond Small Mesa Chips

The common failure modes of wire bonds, for instance cratering/peeling, bond wire damage, trailing wire bond tails, poor adhesion, and missed bond pads, are exacerbated when wire bonding small MESA chips. There are many variables that need to be balanced to optimize a wire bond process, and limit the amount of time consuming and costly rework and part failures. With decades of experience successfully wire bonding small MESA chips for military, aerospace, satellite communications, and other applications, SemiGen experts share some of their insights into the challenges of wire bonding these ever-shrinking ICs.


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