PIN Diodes

The SemiGen SGP7000 series of PIN Diodes are processed with a high-resistivity epi that have intrinsic layers that range in thickness from 4 micron to 200 micron depending on performance specifications. These devices are typically manufactured with either a robust thermal-oxide passivation or ceramic glass for durable high-power applications. These diodes are made with a grown junction P++ layer that yields abrupt junction structures that provide low punch through voltages and minimize autodoping. They are available as chips or in your choice of packages.

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PK 11
Semigen package PK-11
PK 19
Semigen package PK-19
PK 20
Semigen package PK-20
PK 25
Semigen package PK-25
PK 28
Semigen package PK-28
PK 31
Semigen package PK-31
PK 32
Semigen package PK-32
PK 33
Semigen package PK-33
PK 35
Semigen package PK-35
PK 36
Semigen package PK-36
PK 37
Semigen package PK-37
PK 38
Semigen package PK-38
PK 43
Semigen package PK-43
PK 75
Semigen package PK-75

Ultra-Fast Switching PINs

Part
Number
Vb 10 μA
Volts
MIN
Cj-10
MAX
(PF)
TL
TYP
(nS)
Øjc
MAX
deg C/W
TS.
MAX
NS
RS @ 50 mA
Ohms
MAX
RS @ 10mA
OHMS
TYP
SGP7010 25 0.10 10 60 1.5 0.70 1.00
SGP7011 25 0.15 10 50 1.5 0.55 0.80
SGP7012 25 0.20 10 40 1.5 0.45 0.70
SGP7013 25 0.25 10 35 1.5 0.40 0.60

Fast-Switching, Low-Power PINs

Part
Number
Vb 10 μA
Volts
MIN
Cj-10
MAX
(PF)
TL
TYP
(nS)
Δjc
MAX
deg C/W
TS.
MAX
NS
RS @ 75 mA
Ohms
MAX
RS @ 20mA
OHMS
TYP
SGP7020 70 0.05 60 80 5 0.90 1.20
SGP7021 70 0.10 60 70 5 0.70 1.00
SGP7022 70 0.15 60 60 5 0.60 0.90
SGP7023 70 0.20 60 55 5 0.50 0.70
SGP7024 70 0.25 60 50 5 0.45 0.50
SGP7025 100 0.03 100 90 10 1.20 1.90
SGP7026 100 0.07 100 80 10 0.90 1.50
SGP7027 100 0.10 100 70 10 0.70 1.20
SGP7028 100 0.15 100 60 10 0.60 1.00
SGP7029 100 0.20 100 55 10 0.50 0.90
SGP7030 100 0.30 100 50 15 0.45 0.80
SGP7031 200 0.03 225 90 15 1.90 3.00
SGP7032 200 0.07 225 80 15 1.20 2.20
SGP7033 200 0.10 225 70 15 0.90 1.60
SGP7034 200 0.15 225 60 15 0.80 1.00
SGP7035 200 0.20 225 55 15 0.70 0.80
SGP7036 200 0.30 225 50 15 0.60 0.70

Medium-Power General-Purpose PINs

Part
Number
Vb 10 μA
Volts
MIN
Cj-10
MAX
(PF)
TL
TYP
(nS)
Δjc
MAX
deg C/W
TS.
MAX
NS
RS @ 75 mA,
F = 100 MHz
Ohms
MAX
RS @ 20mA
OHMS
TYP
SGP7040 200 0.03 400 65 20 2.60 3.50
SGP7041 200 0.07 400 60 20 1.50 2.20
SGP7042 200 0.10 400 55 20 1.30 2.00
SGP7043 200 0.15 400 50 20 1.00 1.90
SGP7044 200 0.20 400 45 20 0.80 1.70
SGP7045 200 0.30 400 40 20 0.70 1.40
SGP7046 200 0.50 400 20 20 0.60 1.20
SGP7047 200 0.03 600 60 25 2.60 3.50
SGP7048 200 0.07 600 55 25 1.60 3.20
SGP7049 200 0.10 600 50 25 1.20 2.00
SGP7050 200 1.50 600 45 25 0.90 1.90
SGP7051 200 0.20 600 40 25 0.80 1.70
SGP7052 200 0.30 600 35 25 0.70 1.40
SGP7053 200 0.50 600 15 25 0.60 1.20

High-Power Switching and Attenuation PINs

Part
Number
Vb 10 μA
Volts
MIN
Cj-10
MAX
(PF)
TL
TYP
(μS)
Rs @ 1 mA
MAX
(Ohms)
RS @ 10 mA
MAX
(Ohms)
RS @ 100 mA
MAX
(Ohms)
Øjc
MAX
deg C/W
SGP7060 250 0.05 1.00 25.00 10.00 2.00 20.00
SGP7061 250 0.08 1.00 20.00 8.00 1.50 20.00
SGP7062 250 0.10 1.00 15.00 6.00 1.20 20.00
SGP7063 250 0.20 1.00 8.00 3.50 1.00 15.00
SGP7064 250 0.30 1.50 6.00 2.00 0.80 15.00
SGP7065 500 0.08 1.50 40.00 8.00 1.50 15.00
SGP7066 500 0.10 1.50 15.00 5.00 1.20 15.00
SGP7067 500 0.20 1.50 10.00 4.00 1.00 12.00
SGP7068 500 0.30 2.00 8.00 3.50 0.80 10.00
SGP7069 500 0.50 2.00 6.00 2.00 0.70 10.00

High-Voltage PINs

Part
Number
Vb 10 μA
Volts
MIN
CT V=100 V
F = 1 MHz
pf
MAX
TL = 10
mA
μsec
MIN
RS @ 100 mA,
F = 100 MHz
Ohms
MAX
Thermal
Resistance
(C/W)
Typical
SGP7070 1000 0.10 1.00 1.50 30.00
SGP7071 1000 0.25 2.00 1.20 25.00
SGP7072 1000 0.50 3.00 1.00 20.00
SGP7073 1000 0.75 3.50 0.80 10.00
SGP7074 1000 1.30 4.00 0.40 8.00
SGP7075 1000 2.50 4.50 0.35 5.00

Features:

  • Low Capacitance and Resistance
  • Easily Bondable with our F.A.C. Mesas
  • High Reliability

Applications:

For use in low- to high-power switch, attenuator, duplexer and phase-shifting applications from 2 to 20 GHz.

 

Downloads:

The Ubiquitous Microwave Diode. Chapter 2: PIN Diodes
Blog

The Ubiquitous Microwave Diode. Chapter 2: PIN Diodes

Tech Brief Describes How To Bond Small Mesa Chips
Resource

Tech Brief Describes How To Bond Small Mesa Chips

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