The common failure modes of wire bonds, for instance cratering/peeling, bond wire damage, trailing wire bond tails, poor adhesion, and missed bond pads, are exacerbated when wire bonding small MESA chips. There are many variables that need to be balanced to optimize a wire bond process, and limit the amount of time consuming and costly rework and part failures. With decades of experience successfully wire bonding small MESA chips for military, aerospace, satellite communications, and other applications, SemiGen experts share some of their insights into the challenges of wire bonding these ever-shrinking ICs.
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