We are excited to be exhibiting in booth #173 at the 2019 International Microwave Symposium (IMS) in Boston, MA, June 4th to June 6th.
In addition to holding discussions on our full suite of RF products, services, and solutions — which include a line of diodes and passive semiconductors, high frequency microwave assembly and testing services, and bonding supplies — We will be featuring our expanding capability to assist RF/microwave hybrid module manufacturers with our foundry requirements and thin film circuit manufacturing needs.
Our ion beam milling technology is a dry etching thin film circuit manufacturing technique in which the ions of an inert gas are accelerated from an ion source into the surface of the substrate in order to remove the metals. The advantage of our thin film technology, is that it is anisotropic, meaning the removal of the metals is highly specific in the vertical direction, resulting in minimum undercutting of the underlying metals during the etching process. This results in the best and most repeatable thin film traces and spaces, and excellent eutectic value and bond strength.
We also offer wafer processing of 100 to 150 mm silicon wafers, and alumina (Al) and aluminum nitride (AlN) substrates up to 4.25 inches. Services include photolithography, wet etch, dry etch, metallization, grinding, polishing, and in-process metrology.
Recent investments in RF test and high reliability (Hi-Rel) environmental test capabilities has also enabled us to offer solutions for MIL-STD screening of amplifiers, FETs, MMICs, transistors, diodes, and other active and passive circuits and components.
Tests are performed and are delivered with full documentation in accordance with MIL-PRF-19500, MIL-PRF-38534, and MIL-PRF-38535 requirements. Element evaluation and screening options from Class H, Class K, TX, TXV, S-level, as well as custom SCD driven requirements, are also available.
To learn more, visit us in booth #173 at IMS 2019. We look forward to meeting you!