Ion Beam Milling
SemiGen’s Ion Beam Milling Service is a dry etching technique in which the ions of an inert gas are accelerated from an ion source into the surface of the substrate in order to remove the metals. The advantage of Ion Beam Milling is that it is anisotropic, meaning the removal of the metals is highly specific in the vertical direction, resulting in minimum undercutting of the underlying metals during the etching process.
Ion beam etching technology provides a superior etching process over conventional chemical etching. With ion beam etching, there is no undercutting or cross-contamination, resulting in better overall RF circuit performance.
Ion Etching and Photolithography tools are used to manufacture a wide variety of unique products for biomedical, optical and magnetic applications. Some materials and applications:
Micro Machining
- Silicon Wafers Si – IR Chopper Disc, Micro-Fluidics
- Gallium Arsinide (GaAs)
- Alumina Titanium Carbon Al2O3TiC Magnetic Heads for Disk Drives
- Stainless Steel Molds Biomedical applications
- Cylinder Etching Gyroscope application
- Holographic Mirrors Optics and Laser
Etching depths, for products listed above, can range from a few thousand Angstroms to several microns.
Etch rates (Unit = Angstroms/Minute) posted here are estimates intended to provide insight on the etching of various materials.
Actual etch rates will vary depending on material stock used.
Etch rates (Unit = Angstroms/Minute) posted here are estimates intended to provide insight on the etching of various materials.
Actual etch rates will vary depending on material stock used.
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SemiGen can process your etching requirements on customer supplied circuits and substrates..
