SemiGen


How to Balance Process Variables and Wire Bond Tool Customizations to Handle Small MESA Chips

Posted on Wednesday, June 21, 2017
How to Balance Process Variables and Wire Bond Tool Customizations to Handle Small MESA Chips

SemiGen, Inc. announces a new Technical Brief, “Tips for Increasing Yields when Wire Bonding Small MESA Chips,” discussing the challenges of wire bonding to small MESA chips. This latest brief provides insights into the wire bonding process and shares tips on how to analyze and overcome the pitfalls when wire bonding small MESA chips.

Progressively, MESA chips have decreased in size. These shrinking chip geometries also result in smaller pitches, bad widths, wire bond diameters, and bonding areas. Higher data rates, signal integrity requirements, and greater performance metrics for RF/microwave connections have also required greater precision wire bonding and reduced parasitics associated with wire bond lengths, diameters, and wire bond quality. With sub-1-mil wire diameters and sub-40-micron wire bonding areas, developing a reliable and repeatable wire bond process, automated or manual, has become an escalating challenge.

With extensive experience in wire bonding small MESA chips, and meeting the robust standards and quality demands of military, aerospace, and satellite communications, experts with SemiGen have formulated methods to optimize a wire bonding process to deliver exceptional repeatability and reliability. Some of this knowledge and perspective is shared in their latest technical brief.

Learn more by downloading the Technical Brief, “Tips for Increasing Yields when Wire Bonding Small MESA Chips.” 

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