The RF/Microwave Contract Assembly Specialist
SemiGen is vastly experienced in manufacturing and testing of RF, microwave, and millimeter wave circuits and assemblies. Our J-STD and IPC 610 certified assemblers are experts in advanced thermo compression, ultrasonic, ball-bonding, and hand-assembly techniques. We're trusted by leading brands when component position, loop height, and spacing are critical to performance.
Our standard services include:
- Die attachment (epoxy or solder)
- Wire bonding (gold and aluminum wire and ribbon)
- Ribbon bonding
- Coil winding and tacking
- Beam lead diode attachment
- Feedthru installation
- Board installation (epoxy, solder, screw down)
- Hand soldering
- Surface mounting
- Epoxy encapsulation
In addition to build-to-print services, we offer troubleshooting, repair, and re-certification of units that return from the field. Our facility is approved by several defense contractors and we can up screen devices to comply with all military specifications and requirements.
SemiGen provides turnkey electrical and quality testing of RF/Microwave hybrids and components up through 40 GHz in our in-house test lab. We also provide full tuning to customer requirements, inspection, and final ATP with Certificate of Compliance. Typical tuning methods include stub-tuning, impedance matching, capacitive, and inductive.
Test parameters include:
- Insertion loss
- Noise figure
- Phase and phase tracking
- Switching speed
- Various power testing
- Series resistance
- DC electricals VF, VB, CT, IR
- Bond-pull testing and die shear
- Failure analysis of diodes
If lot qualifications, design reviews and production feasibility reports are slowing you down, SemiGen can help. We offer complete semiconductor evaluation services for you and your customers when you need to quickly qualify new devices. Having trouble with a device? Not sure what your failure mode is? Look to SemiGen to solve these problems by providing an evaluation report that gets to the root of the discrepancies. Our engineers will take your golden unit and a test unit, run side-by-side evaluations of diodes, transistors, MMICs, FETs, and passive devices and turn around accurate reports in a matter of days.
SemiGen offers fast, accurate die pick and place from Si and GaAs wafers into waffle pack, gel pack, or film frames using Laurier and Royce Automatic and Semi Automatic Machines. We also offer mirror die in waffle pack for use in trade shows or for machine setup and test to emulate production.
In addition to RF/Microwave assembly, SemiGen is also experienced in producing assemblies for industrial (transducers, encoders, and control boards), medical (sensors and instrumentation boards) and optoelectronic (LED assemblies, receivers, and drivers) applications.