The RF/Microwave Contract Assembly Specialist

SemiGen is vastly experienced in manufacturing and testing of RF, microwave, and millimeter wave circuits and assemblies. Our J-STD and IPC 610 certified assemblers are experts in advanced thermo compression, ultrasonic, ball-bonding, and hand-assembly techniques. We're trusted by leading brands when component position, loop height, and spacing are critical to performance.

Our standard services include:

• Die attachment (epoxy or solder)
• Wire bonding (gold and aluminum wire and ribbon)
• Ribbon bonding
• Coil winding and tacking
• Beam lead diode attachment
• Feedthru installation
• Board installation (epoxy, solder, screw down)
• Hand soldering
• Surface mounting
• Epoxy encapsulation

In addition to build-to-print services, we offer troubleshooting, repair, and re-certification of units that return from the field. Our facility is approved by several defense contractors and we can up screen devices to comply with all military specifications and requirements.

RF/Microwave Testing

SemiGen provides turnkey electrical and quality testing of RF/Microwave hybrids and components up through 40 GHz in our in-house test lab. We also provide full tuning to customer requirements, inspection, and final ATP with Certificate of Compliance. Typical tuning methods include stub-tuning, impedance matching, capacitive, and inductive.

Test parameters include:

• Isolation
• Insertion loss
• Gain
• Noise figure
• VSWR
• Phase and phase tracking
• IP3
• Switching speed
• Various power testing
• Lifetime
• Series resistance
• DC electricals VF, VB, CT, IR
• Bond-pull testing and die shear
• Failure analysis of diodes

Semiconductor Evaluations

If lot qualifications, design reviews and production feasibility reports are slowing you down, SemiGen can help. We offer complete semiconductor evaluation services for you and your customers when you need to quickly qualify new devices. Having trouble with a device? Not sure what your failure mode is? Look to SemiGen to solve these problems by providing an evaluation report that gets to the root of the discrepancies. Our engineers will take your golden unit and a test unit, run side-by-side evaluations of diodes, transistors, MMICs, FETs, and passive devices and turn around accurate reports in a matter of days.

Die Sorting

SemiGen offers fast, accurate die pick and place from Si and GaAs wafers into waffle pack, gel pack, or film frames using Laurier and Royce Automatic and Semi Automatic Machines. We also offer mirror die in waffle pack for use in trade shows or for machine setup and test to emulate production.

Other Markets

In addition to RF/Microwave assembly, SemiGen is also experienced in producing assemblies for industrial (transducers, encoders, and control boards), medical (sensors and instrumentation boards) and optoelectronic (LED assemblies, receivers, and drivers) applications.

Fast, flexible, efficient...we're a PCB assembly machine.

For high-mix, low-to-medium volume printed circuit board assembly (PCBA) SemiGen is a machine of efficiency. We help manufacturers of military electronics, commercial products, and medical instrumentation with their lead-less, fine-pitch, BGA, and QFP assembly requirements by offering an experienced team, a fully automated surface-mount MYDATA machine and a high temperature bake-in oven. We also offer additional through-hole manufacturing capabilities. So you can rest assured your boards will be delivered complete, on time and with the utmost quality.

SMT Assembly Capabilities

• Lead less
• Fine pitch
• BGA
• MicroBGA
• QFP
• LIDS
• Diverse passive components

Full Range of Component Handling

SemiGen's automated PCB line can handle and place a full range of components on virtually any board. This includes everything from 0402 and CSP/FC components on up to complicated BGA- and QFP-types. With the trend towards miniaturization and odd-shaped components, it's essential to have a partner with an all-in-one machine.

Any size or shape PCBs

The ability to handle PCBs of any shape and size — from small boards to giant backplanes — is another key aspect to our flexible production. We can also easily switch between an in-line solution for larger batches and the specialized prototyping of smaller boards.

A Large Mix of Boards

Increasing demands in terms of board size and number of layers require a resource that can handle boards that are large and small, thick and thin. We can take on ultra-small boards or boards as large as 1117 x 812 mm (44" x 32") and as thick as 12.5 mm (1/2"). Odd-shaped boards can also be accommodated. And with MYDATA's Intelligent Surface Impact Control (ISIC), even placement on thin panels and warped boards is not a problem.

Production on Demand

Because our MYDATA machine is easily configured, we can set up for new components and respond to your needs as they arise.

Our Focus is on Throughput

Even the smallest of errors can slow down a manufacturing process. That's why our machine's operating software has features such as electrical verification and low feeder warning lights to ensure that new components are loaded correctly and ahead of time. Our machine picks components and performs electrical and dimensional verification in process, and rejects improper components while the board continues to be built.

While others may talk about their output per hour, SemiGen knows that in a high-mix environment, the only issue that matters is how many quality boards we've produced at the end of the day.

We're New England's premier contract manufacturer of RF/Microwave hybrid assemblies and surface mount printed circuit boards (PCBAs).

From design and prototype engineering assistance, to semiconductor evaluations, hand and automated assembly, repairs, and final testing, you can rely on SemiGen to help you meet your low and high volume manufacturing requirements.

Our facility is fully outfitted with the latest equipment and expert personnel, including all assets acquired in the purchase of Alternative Microwave Resources (AMR) in 2010. Our business is to help your business succeed by being a nimble, service-oriented, and quality-minded resource for all your assembly and testing needs. All work is performed in a Class 100,000 controlled clean room environment and we are deeply experienced at meeting the quality and delivery requirements of the RF/microwave, telecom, EW, defense, military, homeland security, optical, and medical electronics industries.

New RF Supply Center!

As a value-added service , our RF Supply Center provides fast delivery of your most common epoxy pastes and sheets, adhesives, epoxy pre-forms, gold bonding wire and ribbon, and bonding tools.

Engineering and Testing Services

In addition to our hybrid assembly and automated surface mount services, SemiGen offers personal assistance with prototype design as well as with process development procedures. These offerings are designed for customers seeking to minimize their time-to-market or compare and contrast various assembly processes.

Engineering Services

• Material selection
• Process development
• Design for manufacturability
• Epoxy, solder, and wire selection
• Vendor suggestions for substrates, circuit boards, housings, and components

Other Services

• Semiconductor evaluations
• Automation consultation
• Small-lot/box builds
• Die pick and place into carriers

SemiGen News

• 

  SemiGen Opens RF Supply Center. Michelle Richards named as Director.

  SemiGen has announced the opening of our new RF Supply Center and will begin accepting orders for epoxies, bonding tools, gold wire and other supplies used in the manufacture and test of microwave modules and components on January 3rd, 2012. The center is fully stocked and located adjacent to the SemiGen manufacturing center. It will be ready to provide immediate delivery of epoxy paste and sheets, epoxy pre-forms, gold wire, bonding tools and supplies from all major suppliers. No minimum order is required, saving consumers from traditionally long lead times and higher minimum orders when they buy direct from manufacturers.

  The move is in direct response to customer requests for quick delivery of their most commonly used supplies in their own RF/Microwave assembly as well to supply kits on the SemiGen manufacturing floor for turnkey build-to-print services.

  Michelle Richards, formerly of Bonding Source, will join SemiGen as Director of the RF Supply Center. Michelle is a respected leader in her field and is an assembly and bonding supply expert. She will be instrumental in creating a fully available line of the most sought after products used every day in RF and microwave manufacturing.

  "Adding an RF Supply Center right into our facility completes the puzzle for our customers," said Jim Morgan, President of SemiGen. "Having key supplies and components on-hand for just-in-time delivery to their floor or ours avoids a common stumbling block in meeting deadlines."

  SemiGen also has plans to introduce classes in wirebonding and die attachment as a benefit to customers needing to augment their own staff. These classes will also provide SemiGen a continuous pool of talent for their assembly floor. Night training classes are expected to begin in June of 2012. A class schedule will be published in April 2012.
• 

  SemiGen Relocates, Expanding RF/Microwave Assembly and Test Capabilities

  SemiGen has announced that the company is moving to a new facility and expanding its RF/microwave assembly and test capabilities. To meet the demands of customer requirements and to accommodate SemiGen's recent acquisitions and new product line repair business, SemiGen has relocated from its former location in Londonderry, NH to 920 Candia Road in Manchester, NH. The new, 25,000 square foot space adds a second SMT line as well as a Class 10000 ESD Zero clean room for RF microwave assembly, and SemiGen's newest capital acquisition, an MRSI605 Automatic Eutectic Die Bonder.

  SemiGen's certified assemblers are experts in advanced thermo compression, ultrasonic, ball-bonding, and hand assembly techniques. Standard services include: die attachment (epoxy or solder), wire and ribbon bonding (gold and aluminum), coil winding and tacking, beam lead diode attachment, feedthru installation, board installation (epoxy, solder, screw down), hand soldering, surface mounting, and epoxy encapsulation. In addition to build-toprint services, SemiGen offers troubleshooting, repair, and re-certification of units that return from the field. SemiGen's facility is approved by several defense contractors and can up screen devices to comply with all military specifications and requirements.

  SemiGen also provides electrical and quality testing of RF/Microwave hybrids and components up through 40 GHz in an in-house test lab. They offer full tuning to customer requirements, inspection, and final ATP with Certificate of Compliance. Typical tuning methods include stub-tuning, impedance matching, capacitive, and inductive. SemiGen tests on a number of parameters, including isolation, insertion loss, gain, noise figure, VSWR, phase and phase tracking, IP3, switching speed, various power testing, lifetime, series resistance, DC electricals (VF, VB, CT, IR), bond-pull testing and die shear, and failure analysis of diodes.
• 

  SemiGen Acquires Element Manufacturing of Nashua, NH

  James P. Morgan, President of SemiGen, is pleased to announce the acquisition of Element Manufacturing of Nashua New Hampshire (www.elementmfg.com), a surface mount and thru hole contract manufacturer. Element will remain in its current 7000 square foot facility in Nashua until later this year after which SemiGen and Element will be consolidated into a new 25,000 square foot facility in Manchester, New Hampshire.

  "This acquisition gives us technical advantages in SMT and thru hole assembly that complement our core services and expand our manufacturing," said Morgan, "With this piece, SemiGen is moving in the direction of a one stop shop for commercial and military applications involving technical expertise and quality with advances in assembly and test offerings."

  Tammy Tisbert, CEO of Element, will join the SemiGen team as Director of SMT Assembly. "I started Element 4 years ago to build a premium service company that prided itself on fast turn and high quality," Tisbert said. "SemiGen gives Element the depth it lacks in the front end of the business and adds tremendous support to our overall ability to grow and service our customers."
• 

  SemiGen Now Offering Semiconductor Evaluations

  SemiGen is pleased to announce full service lot qualifications, design reviews and production feasibility reports on a variety of die and surface mount packaged semiconductor devices. These services have been specifically designed to assist semiconductor manufacturers and their customers when they need to quickly qualify new devices. Evaluation reports are derived by taking a manufacturer's golden unit and a test unit, and running side-by-side evaluations of all diodes, transistors, MMICs, FETs, and passive devices.

  For turnkey service, SemiGen also offers fast, accurate die pick and place from Si and GaAs wafers into waffle pack, gel pack, or film frames using Laurier and Royce automatic and semi automatic machines.
• 

  SemiGen Completes Integration of AMR, Inc.

  SemiGen has announced the complete integration of previously acquired Alternative Microwave Resources of Amherst New Hampshire, into our Londonderry facility. AMR was a privately held contract manufacturer specializing in hybrid assembly, engineering, and testing of RF and microwave modules up to 40 GHz. The company was also a troubleshooting and repair specialist of various units such as amplifiers, VCOs, limiters, and other military subsystems and modules that needed repair down to the component level.

  The integration of AMR complements our core assembly business while expanding our test and verification services.

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